METHOD FOR FORMING GROOVE FOR GRINDING IN RESIN BOND GRINDSTONE AND RESIN BOND GRINDSTONE, AND PROCESSING DEVICE FOR PLATE-LIKE BODY AND PROCESSING METHOD FOR PLATE-LIKE BODY

摘要

PROBLEM TO BE SOLVED: To provide a method for forming a groove for grinding in a resin bond grindstone by which the groove for grinding an end part of a plate-like body can be formed in a groove shape corresponding to a shape of a marginal part of the plate-like body, a resin bond grindstone manufactured by such a formation method, a processing device for the plate-like body with use of the resin bond grindstone, and a processing method for the plate-like body.SOLUTION: While a marginal part 12A of a glass plate 12 is so ground by a metal bond grindstone 18 as to form a chamfered surface, a flat outer peripheral surface 43 of a resin bond grindstone 26 is pressed to the chamfered surface thereby forming an annular groove 44 in each outer peripheral surface 43 of resin bond grindstones 26, 28. According to this formation method, the annular groove 44 having a same outline shape as the chamfered surface of the glass plate 12 can be formed on the outer peripheral surface 43 of the resin bond grindstone 26. Further, while forming the annular groove 44, the chamfered surface can be ground by the formed annular groove 44. Consequently, chamfering efficiency of the glass plate 12 can be increased.