首页> 外国专利> TREATMENT SOLUTION, ACIDIC ELECTROPLATING BATH, ELECTROPLATING COATING, AND ELECTROPLATING COATING FORMING METHOD

TREATMENT SOLUTION, ACIDIC ELECTROPLATING BATH, ELECTROPLATING COATING, AND ELECTROPLATING COATING FORMING METHOD

机译:处理溶液,酸性电镀浴,电镀涂层和电镀涂层的形成方法

摘要

PROBLEM TO BE SOLVED: To provide a technology capable of forming a composite plating coating having uniform particle diameter at nanometer size and containing 10 wt.% or more of molybdenum disulfide.;SOLUTION: A molybdenum disulfide derivative solution is produced by addition reaction of tetra thio ammonium molybdate and sodium 2-propyne-1-sulfonate. Then an electroplating coating is formed by using an acidic electroplating bath containing the solution. Since metals such as nickel, copper, and cobalt in the plating bath do not deposit even when the molybdate derivative solution is added to the acidic electroplating bath, a composite plating coating of molybdenum disulfide and metals in the plating bath can be formed by the acidic electroplating bath containing the solution. This enables forming a composite plating coating containing molybdenum disulfide of 10 wt.% or more with having uniform particle diameter at nanometer size.;COPYRIGHT: (C)2015,JPO&INPIT
机译:解决的问题:提供一种能够形成纳米尺寸且粒径均一且含有10重量%以上的二硫化钼的复合镀膜的技术。解决方案:通过四价铬的加成反应制备二硫化钼衍生物溶液。硫代钼酸铵和2-丙炔-1-磺酸钠。然后通过使用包含该溶液的酸性电镀浴形成电镀涂层。由于即使将钼酸盐衍生物溶液添加到酸性电镀浴中,镀浴中的诸如镍,铜和钴的金属也不会沉积,因此可以通过酸性形成二硫化钼和电镀浴中金属的复合镀层。电镀液中的溶液。这样就可以形成一种复合镀膜,该复合镀膜包含10 wt。%或更多的二硫化钼,并且在纳米尺寸下具有均匀的粒径。;版权所有:(C)2015,JPO&INPIT

著录项

  • 公开/公告号JP2015083708A

    专利类型

  • 公开/公告日2015-04-30

    原文格式PDF

  • 申请/专利权人 YUKEN INDUSTRY CO LTD;

    申请/专利号JP20130221794

  • 发明设计人 ISHIZAKI SHINJI;ITO KAZUO;

    申请日2013-10-25

  • 分类号C25D15/02;C25D5/18;

  • 国家 JP

  • 入库时间 2022-08-21 15:32:39

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