首页> 外国专利> LASER IRRADIATION CHIP, AND FIBER MODULE FOR USE IN LASER IRRADIATION CHIP

LASER IRRADIATION CHIP, AND FIBER MODULE FOR USE IN LASER IRRADIATION CHIP

机译:激光辐照芯片,以及用于激光辐照芯片的光纤模块

摘要

PROBLEM TO BE SOLVED: To provide a laser irradiation chip enabled to retain the field of view of an irradiation object part by eliminating a connection loss of a laser beam in a laser light guide part in a laser irradiation chip, and by suppressing the enlargement of the leading end side part of the chip, and a fiber module to be used in the laser irradiation chip.;SOLUTION: A fiber module comprises: a pipe-shaped chip body part 5; a connection part 7 disposed at a base end part 50 of the chip body part 5 and connected to a leading end portion 20C of a hand piece 2; a fiber 9 inserted into the chip body part 5 for guiding a therapeutic laser; and an attachment part 10 disposed at a base end part 9b of the fiber 9. The fiber 9 and the attachment part 10 are integrated to constitute a fiber module 6, and this fiber module 6 is removably mounted on the chip body part 5.;COPYRIGHT: (C)2015,JPO&INPIT
机译:解决的问题:提供一种激光照射芯片,该激光照射芯片能够通过消除激光照射芯片中的激光引导部中的激光束的连接损耗并抑制其扩大来保持被照射部的视场。解决方案:光纤模块包括:管状的芯片主体部分5;芯片的前端侧部分;以及用于激光辐照芯片的光纤模块。连接部7,其配置在芯片主体部5的基端部50,并与机头2的前端部20C连接。光纤9插入芯片主体部分5中以引导治疗激光。光纤9和安装部10一体化而构成光纤模块6,该光纤模块6可装卸地安装在芯片主体部5上;在光纤9的基端部9b上设置有安装部10。版权:(C)2015,JPO&INPIT

著录项

  • 公开/公告号JP2014217513A

    专利类型

  • 公开/公告日2014-11-20

    原文格式PDF

  • 申请/专利权人 MORITA MFG CO LTD;

    申请/专利号JP20130097469

  • 发明设计人 HAMADA KAZUNORI;

    申请日2013-05-07

  • 分类号A61C3/02;

  • 国家 JP

  • 入库时间 2022-08-21 15:32:40

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