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BENDING DEFORMATION AMOUNT MEASUREMENT METHOD AND BENDING DEFORMATION AMOUNT MEASUREMENT DEVICE

机译:弯曲变形量的测量方法和弯曲变形量的测量装置

摘要

PROBLEM TO BE SOLVED: To provide a bending deformation amount measurement method capable of accurately measuring a multidirectional bending deformation amount of a measurement object, and to provide a bending deformation amount measurement device having a simple configuration used in the bending deformation amount measurement method.;SOLUTION: In the bending deformation amount measurement method, two reference points P1 and P1 and one comparison point P2 are previously set at separate positions on the same straight line LB of a pile 2. After deformation of the pile 2, physical quantity correlating with a perpendicular separation distance of at least two directions between the linear line passing the reference points P1 and P1 and the comparison point P2 is measured, thereby measuring the multidirectional bending deformation amount of the pile 2. A bending deformation amount measurement device used for the measurement method is also provided.;COPYRIGHT: (C)2015,JPO&INPIT
机译:解决的问题:提供一种能够准确地测量被测物的多方向弯曲变形量的弯曲变形量测量方法,并且提供一种具有简单结构的弯曲变形量测量装置,该弯曲变形量测量装置用于该弯曲变形量测量方法中。解决方案:在弯曲变形量测量方法中,两个参考点P1和P1和一个比较点P2预先设置在桩2的同一直线LB上的不同位置。桩2变形后,与a关联的物理量测量通过基准点P1和P1的直线与比较点P2之间的至少两个方向的垂直分离距离,从而测量桩2的多向弯曲变形量。一种用于测量方法的弯曲变形量测量装置版权:(C)2015,JPO&INPIT

著录项

  • 公开/公告号JP2014232050A

    专利类型

  • 公开/公告日2014-12-11

    原文格式PDF

  • 申请/专利权人 TAISEI CORP;

    申请/专利号JP20130113283

  • 发明设计人 SHIBA YUKIO;

    申请日2013-05-29

  • 分类号G01B7/16;G01B5/30;

  • 国家 JP

  • 入库时间 2022-08-21 15:32:04

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