首页> 外国专利> METHOD FOR PREPARING BONDED JOINT SPECIMEN, BONDED JOINT SPECIMEN, AND TESTING METHOD FOR TENSILE BOND STRENGTH

METHOD FOR PREPARING BONDED JOINT SPECIMEN, BONDED JOINT SPECIMEN, AND TESTING METHOD FOR TENSILE BOND STRENGTH

机译:粘合接缝试样的制备方法,粘合接缝试样以及拉伸粘合强度的测试方法

摘要

PROBLEM TO BE SOLVED: To provide a method for preparing a bonded joint specimen, in which such the bonded joint specimen can be prepared that imbalance of a bonded state hardly exists between the central vicinity of the bonded plane and the edge vicinity thereof, and to provide the bonded joint specimen and a testing method for tensile bond strength.;SOLUTION: When one adherend 1 and the other adherend 4 are bonded to each other by using an adhesive 3 to prepare the bonded joint specimen, the area of an adhesive plane 4a of the other adherend 4 is set larger than that of another adhesive plane 1a of the one adherend 1 and the adhesive 3 is applied to the space between the adhesive plane 1a of the one adherend 1 and the 4a of the other adherend 4 so that an excess portion 3a of the adhesive 3 is brought into contact with the side face 1b existing along the edge of the adhesive plane 1a of the one adherend 1 having the adhesive plane 1a of the smaller area.;COPYRIGHT: (C)2015,JPO&INPIT
机译:解决的问题:提供一种制备接合接头样品的方法,其中可以制备这样的接合接头样品,使得在接合平面的中心附近和其边缘附近之间几乎不存在接合状态的不平衡,并且提供粘合的接头样品和拉伸粘合强度的测试方法。;解决方案:当一个被粘物1和另一个被粘物4通过使用粘合剂3相互粘合以制备粘合的接合样品时,粘合面4a的面积另一被粘物4的粘合面1a被设置成大于一个被粘物1的另一粘合面1a的粘合面,并且粘合剂3被施加到一个被粘物1的粘合面1a与另一被粘物4的粘合面4a之间的空间。使粘合剂3的多余部分3a与沿着一个具有较小面积的粘合平面1a的被粘物1的粘合平面1a的边缘存在的侧面1b接触。版权所有:(C)2015,JPO&INPIT

著录项

  • 公开/公告号JP2014224212A

    专利类型

  • 公开/公告日2014-12-04

    原文格式PDF

  • 申请/专利权人 IHI CORP;

    申请/专利号JP20130105036

  • 发明设计人 KOBIKI AKIRA;MURATA SHO;

    申请日2013-05-17

  • 分类号C09J201/00;C09J5/00;

  • 国家 JP

  • 入库时间 2022-08-21 15:31:19

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