首页> 外国专利> Method of manufacturing modified polypropylene resin composition, as well as the production method of the polypropylene resin molded article and this by The resulting polypropylene resin molded article

Method of manufacturing modified polypropylene resin composition, as well as the production method of the polypropylene resin molded article and this by The resulting polypropylene resin molded article

机译:所得聚丙烯树脂成型品的制造改性聚丙烯树脂组合物的方法以及聚丙烯树脂成型品的制造方法及其

摘要

PROBLEM TO BE SOLVED: To provide a method for producing a modified polypropylene-based resin composition capable of providing a polypropylene-based resin molded article with improved mechanical strength and rigidity without using inorganic filler.;SOLUTION: The method for producing the modified polypropylene-based resin composition is characterized by comprising a process for obtaining a resin composition for modification including supplying a polypropylene-based resin (I) to a first extruder and melting/kneading it, supplying a polyethylene-based resin to a second extruder and melting/kneading it at 350 to 400°C, supplying a polyester-based resin to a third extruder and melting/kneading it, and then co-extruding the resuting material from a co-extrusion die to obtain an integrated laminated film composed of the polypropylene-based resin (I) film, polyethylene-based resin film and polyester-based resin film laminated in this order, and cutting the laminated film, and a process for melting/kneading 100 pts.wt. of a polypropylene-based resin (II) and 5 to 30 pts.wt. of the resin composition for modification.;COPYRIGHT: (C)2013,JPO&INPIT
机译:解决的问题:提供一种生产改性聚丙烯类树脂组合物的方法,该组合物能够提供具有改进的机械强度和刚性的聚丙烯类树脂模塑制品,而无需使用无机填料。基树脂组合物的特征在于包括获得改性用树脂组合物的方法,该方法包括将聚丙烯基树脂(I)供应至第一挤出机并将其熔融/捏合,将聚乙烯基树脂供应至第二挤出机并熔融/捏合。在350至400°C的温度下,将聚酯基树脂供应至第三台挤出机并熔融/捏合,然后从共挤出模具中共挤出树脂材料,以获得由聚丙烯基树脂制成的集成层压膜依次层叠树脂(I)膜,聚乙烯类树脂膜和聚酯类树脂膜,进行切断,然后进行熔融处理揉捏100 pts.wt.聚丙烯基树脂(II)和5至30 pts.wt.改性用树脂组合物的研究。;版权所有:(C)2013,日本特许厅

著录项

  • 公开/公告号JP5752028B2

    专利类型

  • 公开/公告日2015-07-22

    原文格式PDF

  • 申请/专利权人 積水テクノ成型株式会社;

    申请/专利号JP20110280174

  • 发明设计人 金光 保二;

    申请日2011-12-21

  • 分类号C08L23/12;C08L23/06;C08L67/03;C08J3/20;C08J3/12;B29B9/12;B29C45/00;

  • 国家 JP

  • 入库时间 2022-08-21 15:31:05

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