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slurry circulation system, and, flushing method of slurry circulation system

机译:泥浆循环系统以及泥浆循环系统的冲洗方法

摘要

PROBLEM TO BE SOLVED: To provide a slurry circulation apparatus that can reliably remove a slurry residue remaining in the piping, a polishing device and the like to which the slurry is supplied, and can shorten the time required for flushing.;SOLUTION: The slurry circulation apparatus 3 includes: first and second supply tanks 41, 42; a supply line 43 for supplying the liquid stored in the first and second supply tanks 41, 42 to first and second CMP devices 21, 22; first and second circulation valves 436, 437 for switching supply sources of the liquid to be supplied to the first and second CMP devices 21, 22; a collecting line 63 for collecting the liquid discharged from the first and second CMP devices 21, 22 in the first and second supply tanks 41, 42; a separator 64 for switching destinations in which the liquid is collected; first and second DIW (de-ionized water) replenishing units 53, 54 for replenishing pure water to the first and second supply tanks 41, 42; and an alkaline solution replenishing unit 55 for replenishing an alkaline solution to the first and second supply tanks 41, 42.;COPYRIGHT: (C)2013,JPO&INPIT
机译:解决的问题:提供一种浆料循环装置,该浆料循环装置能够可靠地去除残留在配管中的浆料残渣,供给浆料的研磨装置等,并且能够缩短冲洗所需的时间。循环装置3包括:第一和第二供应箱41、42;以及第一供应箱41和第二供应箱42。供给管线43,其将第一和第二供给罐41、42中存储的液体供给至第一和第二CMP装置21、22。第一循环阀436和第二循环阀437,用于切换向第一CMP装置21和第二CMP装置22供给的液体的供给源。收集管线63用于收集从第一和第二供应罐41、42中的第一和第二CMP装置21、22排出的液体;分离器64,用于切换收集液体的目的地;第一和第二DIW(去离子水)补充单元53、54,用于向第一和第二供应箱41、42补充纯水。碱溶液补充单元55,用于向第一和第二供应箱41、42补充碱溶液。版权所有:(C)2013,日本特许厅&INPIT

著录项

  • 公开/公告号JP5772243B2

    专利类型

  • 公开/公告日2015-09-02

    原文格式PDF

  • 申请/专利权人 株式会社SUMCO;

    申请/专利号JP20110125217

  • 发明设计人 大祥 修;

    申请日2011-06-03

  • 分类号B24B37/34;B24B57/00;B24B37/00;

  • 国家 JP

  • 入库时间 2022-08-21 15:30:09

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