Method of manufacturing an injection mold, injection mold, injection mold set, a manufacturing method of a substrate for the microchip, and a microchip manufacturing method using the mold

摘要

A method for manufacturing a resin mold 13 for molding the flow path 2b, and the first substrate 2 having a through hole 2a, a recess 10b which corresponds to the passage 2b, the concave portion 10b corresponding to the through-hole 2a to prepare a mother die 10 having a deeper hole 10a, and the electroforming in the first material in the matrix 10, on which the electroforming a first electroforming process, electricity in the second material different from the first material thereby forming a protrusion for the target, and forming a through hole 10a by removing the first material that is electrodeposited into the through hole 10a. Stress is smaller electroforming as compared to the second material first material, adhesion to the mold is higher than that of the second material first material, the hardness is higher than the first material and the second material.