Thermally conductive pressure-sensitive adhesive composition, the thermally conductive pressure-sensitive adhesive sheet materials, methods for their manufacture, and electronic components

摘要

PROBLEM TO BE SOLVED: To provide a thermal conductive pressure-sensitive adhesive composition and thermal conductive pressure-sensitive adhesive sheet-like molding, in which reworking is possible just after sticking, and sticking power becomes stronger as time passes, and to provide the production method of the thermal conductive pressure-sensitive adhesive composition and thermal conductive pressure-sensitive adhesive sheet-like molding, and also to provide an electronic component including the thermal conductive pressure-sensitive adhesive composition or the thermal conductive pressure-sensitive adhesive sheet-like molding.;SOLUTION: A mixed composition contains: 100 pts.mass of a (meth)acrylic resin composition (A) containing a (meth)acrylic ester polymer (A1) and a (meth)acrylic ester monomer (α1); 0.3-4 pts.mass of a zinc oxide (C) having an acicular part and 0.1-0.3 g/mL bulk specific gravity; and 600-1,400 pts.mass of an insulating thermal conductive inorganic compound (B) excluding the zinc oxide (C). In the mixed composition, the composition and the molding are obtained by performing: a polymerization reaction of the (meth)acrylic ester monomer (α1); and a cross-linking reaction of a polymer containing the (meth)acrylic ester polymer (A1) and/or a structural unit derived from the (meth)acrylic ester monomer (α1).;COPYRIGHT: (C)2013,JPO&INPIT