Protecting agent, the method of producing the protected compound with a protecting agent, the resin is protected by a protective agent, a photosensitive resin composition containing a protected resin by the protective agent, the pattern forming material, photosensitive film, cured relief pattern, a method of manufacturing the same, and semiconductor device

摘要

Provided are: a protectant of carboxyl groups or hydroxyl groups having excellent storage stability; a resin in which carboxyl groups or hydroxyl groups are protected by the protectant, the resin having excellent storage stability; a photosensitive resin composition containing the protected resin, the photosensitive resin composition having excellent resolution and sensitivity; a pattern-forming material, photosensitive film, and cured film in which the photosensitive resin composition is used; and a method for producing a cured relief pattern, the cured relief pattern obtained thereby, and a semiconductor device equipped with the cured relief pattern, in which the photosensitive resin composition is used. A protectant of hydroxl groups or carboxyl groups, which protectant is a compound represented by general formula (I). (In the general formula, R1 and R2 each independently represent an alkyl group, a cycloalkyl group, an aryl group, an aralkyl group, an alkoxy group, an aryloxy group, an acyl group, an alkoxycarbonyl group, an aryloxycarbonyl group, a cyano group, or a halogen atom, R1 and/or R2 being an aryl group, an alkoxy group, an aryloxy group, an acyl group, an alkoxycarbonyl group, an aryloxycarbonyl group, a cyano group, or a halogen atom. R3 represents an alkyl group, a cycloalkyl group, an aryl group, or an aralkyl group. R1 and R2 may bond together to form a ring, or R1 or R2 may bond to R3 to form a ring. X represents a group that can be desorbed by the action of the hydroxyl groups or carboxyl groups.)