Reduction type electroless silver plating solution.

摘要

PROBLEM TO BE SOLVED: To provide a reducing type electroless silver plating solution without containing a cyanogen compound, excellent in liquid stability.;SOLUTION: The reducing type electroless silver plating solution includes: a water-soluble silver compound; a reducing agent; and a compound represented by the following general formula (1) as a liquid stabilizer. The compound represented by the general formula (1) is preferably a compound of CAS number 68603-67-8. In the formula, R represents an alkyl group or an aryl group, and m and n represent an integer of 1 to 3, respectively.;COPYRIGHT: (C)2012,JPO&INPIT