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Large module including a circuit board for a peripheral circuit of the large module, and a peripheral circuit using the circuit board

机译:大型模块,其包括用于大型模块的外围电路的电路板,以及使用该电路板的外围电路

摘要

The present invention smaller and lighter by lamination of a peripheral circuit of the drive circuit or the like on the power circuit, the low surge reduction and the capacity module is to be Hakaro a low loss, a power semiconductor element which is disposed on the power circuit reduction in the breakdown voltage between the junction adjacent an increase and the electrical resistance at the junction between the electrode terminal and the peripheral circuit of a power semiconductor device alignment of the electrode terminal and the peripheral circuit due to insufficient It wants to reduce the equal of the problem. A provided with a step on the surface of the peripheral circuit board, positioning of the terminal of the step and the power by contact with the side surface of the semiconductor device of the peripheral circuit board during lamination between the power circuit and the peripheral circuit electrodes and the power semiconductor element By performing more accurately, and to alleviate the above problems. .BACKGROUND
机译:通过将驱动电路等的外围电路层叠在电源电路上,本发明变得更小,更轻,本发明的低浪涌降低和电容模块为低损耗的Hakaro,设置在电源上的功率半导体元件由于功率不足,功率半导体器件的电极端子与外围电路之间的对准导致相邻节点之间的击穿电压的增大和电极端子与外围电路之间的交界处的电阻的增大而导致电路减小。问题。一种在外围电路板的表面上设有台阶的步骤,通过在电源电路和外围电路电极之间的层压期间与外围电路板的半导体器件的侧面接触而将台阶的端子和电源定位功率半导体元件通过更精确地执行,从而减轻了上述问题。 。背景

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