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Water-cooling equipment, electronic equipment, and water-cooling method with a water-cooling equipment

机译:水冷设备,电子设备以及具有水冷设备的水冷方法

摘要

Water-cooling unit includes a plurality of system boards on which electronic components (30) is mounted (20), attached to the electronic component, the cooling plate provided with a passage (23) in which refrigerant flows (22) therein, the system board Each and heat transfer member extending through the (20a) of the, provided on the back surface of each of the system board, and a heat radiation member connected to the heat transfer member (28). Emissivity of the heat dissipating member (28) is higher than the emissivity of the heat transfer member 20a.
机译:水冷却单元包括:多个系统板,其上安装有电子部件(30),该电子部件附接至电子部件;冷却板设置有通道(23),制冷剂在其中流动(22);系统板和每个传热构件延伸穿过板的(20a),并设置在每个系统板的背面,并且散热构件连接到传热构件(28)。散热构件(28)的发射率高于传热构件20a的发射率。

著录项

  • 公开/公告号JPWO2013061409A1

    专利类型

  • 公开/公告日2015-04-02

    原文格式PDF

  • 申请/专利权人 富士通株式会社;

    申请/专利号JP20130540534

  • 发明设计人 ▲高▼須 庸一;

    申请日2011-10-25

  • 分类号G06F1/20;H05K7/20;

  • 国家 JP

  • 入库时间 2022-08-21 15:28:08

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