METHOD FOR PRE-SOLDERING METAL SURFACES ONTO METALIZED SUBSTRATES USING A METALLIC GAUZE, METALIZED SUBSTRATES WITH A SOLDER LAYER WHICH HAS A SUPERFICIAL STRUCTURE OF A GAUZE

摘要

A method for pre-soldering metal surfaces onto metallized substrates (1a, 1b), wherein solder preforms (2a, 2b) are placed onto the metal surfaces of the substrates (1a, 1b) or vice versa, after which the solder preforms (2a, 2b) are fused. To achieve a defined, consistent height of the solder layer, inhibit the formation of bulged solder, enable the production of even thicker solder layers of around 100 μm with a thickness fluctuation of below 20 μm to the edge of the solder layer and minimize a pore formation in the solder layer, a metallic gauze (3a, 3b) is pressed flat onto the solder preforms (2a, 2b) during the soldering or fusing processes, the metallic gauze (3a, 3b) consisting of a solder-wetting material.