首页> 外国专利> METHOD AND APPARATUS FOR ANALYZING SUBSURFACES OF A TARGET MATERIAL

METHOD AND APPARATUS FOR ANALYZING SUBSURFACES OF A TARGET MATERIAL

机译:用于目标材料表面分析的方法和装置

摘要

A system that incorporates teachings of the present disclosure may include, for example, a method for aligning first and second light signals on an optical path directed to a target, where the first light signal provides a visualization of the target, and a portion of the second light signal reflects from at least one subsurface of the target. The method also includes aligning a first focal point of the first light signal and a second focal point of the second light signal, where the first focal point is at least in a first proximate location of the second focal point, and adjusting a first position of the first and second focal points to be in at least a second proximate location of the target without adjusting the at least first proximate location of the first focal point relative to the second focal point. Other embodiments are disclosed.
机译:结合本公开内容的教导的系统可以包括例如用于在指向目标的光路上对准第一和第二光信号的方法,其中第一光信号提供目标的可视化,以及第二光信号从目标的至少一个亚表面反射。该方法还包括对准第一光信号的第一焦点和第二光信号的第二焦点,其中第一焦点至少在第二焦点的第一附近位置,并调节第一焦点的第一位置。第一和第二焦点位于目标的至少第二附近位置,而无需相对于第二焦点调整第一焦点的至少第一附近位置。公开了其他实施例。

著录项

  • 公开/公告号US2015173620A1

    专利类型

  • 公开/公告日2015-06-25

    原文格式PDF

  • 申请/专利权人 WELCH ALLYN INC.;

    申请/专利号US201514643187

  • 发明设计人 ERVIN GOLDFAIN;RAYMOND A. LIA;

    申请日2015-03-10

  • 分类号A61B5/00;

  • 国家 US

  • 入库时间 2022-08-21 15:25:56

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