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METHOD AND APPARATUS FOR ANALYZING SUBSURFACES OF A TARGET MATERIAL
METHOD AND APPARATUS FOR ANALYZING SUBSURFACES OF A TARGET MATERIAL
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机译:用于目标材料表面分析的方法和装置
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摘要
A system that incorporates teachings of the present disclosure may include, for example, a method for aligning first and second light signals on an optical path directed to a target, where the first light signal provides a visualization of the target, and a portion of the second light signal reflects from at least one subsurface of the target. The method also includes aligning a first focal point of the first light signal and a second focal point of the second light signal, where the first focal point is at least in a first proximate location of the second focal point, and adjusting a first position of the first and second focal points to be in at least a second proximate location of the target without adjusting the at least first proximate location of the first focal point relative to the second focal point. Other embodiments are disclosed.
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