首页>
外国专利>
QUAD-FLAT NO-LEADS PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME
QUAD-FLAT NO-LEADS PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME
展开▼
机译:四瓣无铅包装结构及其制造方法
展开▼
页面导航
摘要
著录项
相似文献
摘要
A method of manufacturing a quad-flat no-leads package (QFN) structure includes: forming a conducting layer on a surface of a thin-film layer; forming a plurality of conduction wirings from the conducting layer by a means of circuit layout; electrically connecting contact pads of a die to front ends of the conduction wirings, respectively; forming a plurality of through-holes in the thin-film layer by a means of drilling, such that terminal ends of the conduction wirings are exposed from the through-holes, respectively; and forming a plurality of metal bumps at the through-holes, respectively, such that signals from the die are sent to a bottom surface of the thin-film layer through the conduction wirings. Hence, the QFN structure and the method of manufacturing the same based on application of wafer-level chip-scale package (WLCSP) and extension of tape QFN to simplify the package manufacturing process, cut production costs, and enhance production yield.
展开▼