首页> 外国专利> METHOD FOR PRODUCING AT LEAST ONE PAD ASSEMBLY ON A SUPPORT FOR THE SELF-ASSEMBLY OF AN INTEGRATED CIRCUIT CHIP ON THE SUPPORT BY THE FORMATION OF A FLUORINATED MATERIAL SURROUNDING THE PAD AND EXPOSURE OF THE PAD AND THE FLUORINATED MATERIAL TO AN ULTRAVIOLET TREATMENT IN THE PRESENCE OF OZONE

METHOD FOR PRODUCING AT LEAST ONE PAD ASSEMBLY ON A SUPPORT FOR THE SELF-ASSEMBLY OF AN INTEGRATED CIRCUIT CHIP ON THE SUPPORT BY THE FORMATION OF A FLUORINATED MATERIAL SURROUNDING THE PAD AND EXPOSURE OF THE PAD AND THE FLUORINATED MATERIAL TO AN ULTRAVIOLET TREATMENT IN THE PRESENCE OF OZONE

机译：通过围绕在垫板上的氟化材料的形成和垫的暴露以及氟化物对小孔的暴露，在支持的集成电路芯片上的自组装芯片的支撑上至少生产一个垫组件的方法臭氧

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摘要

A method for producing at least one pad assembly (32, 50) on a support (19, 43) for use in a method for self-assembling at least one element (10) on the support (19, 43), comprises fanning, on the support (19, 43), a layer (28, 48) of at least one fluorinated material around the location (30, 44) of the pad assembly (32, 50), the layer (28, 48) having a thickness greater than 10 nm. The layer (28, 48) and the location (30, 44) are exposed to an ultraviolet treatment in the presence of ozone to form the pad assembly (32, 50) at said location (30, 44), wherein a drop of liquid (16) having a static contact angle on the pad assembly (32, 50) less than or equal to 15°, after the exposure to the ultraviolet treatment, has a static contact angle on the layer (28, 48) greater than or equal to 100°.

机译：一种在支撑件（ 19、43 ）上生产至少一个垫组件（ 32、50 ）的方法，该方法用于自组装至少一个元件（ 32、50 ）支撑（ 19，43 ）上的 10 ）包括在支撑（ 19，43 ）上扇形展开一层（ 28、48 ）中至少一种氟化材料围绕着垫组件（ 32、50 ）的位置（ 30、44 ），层（< B> 28、48 ）的厚度大于10 nm。在臭氧存在下，将层（ 28，48 ）和位置（ 30，44 ）进行紫外线处理，以形成垫组件（ 32 ，50 ）在所述位置（ 30、44 ），其中一滴具有静态接触角的液体（ 16 ）在垫组件上（ 32、50 ）小于或等于15°，经过紫外线处理后，在层（ 28，48 ）上的静态接触角大于或等于15° 100°。 展开▼

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公开/公告号US2015287695A1

专利类型

公开/公告日2015-10-08

原文格式PDF

申请/专利权人 COMMISSARIAT A L ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES;STMICROELECTRONICS (CROLLES 2) SAS;
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申请/专利号US201314438668

发明设计人 LÉA DI CIOCCIO;SÉBASTIEN MERMOZ;LOÏC SANCHEZ;
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申请日2013-03-20

分类号H01L23;H01L23/14;H01L21/311;

国家 US

入库时间 2022-08-21 15:22:56

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机译：用于在支撑件上生产至少一个垫组件的方法，用于通过在垫周围形成氟化材料并使垫和氟化材料在存在的情况下进行紫外线处理而在支撑件上自组装集成电路芯片臭氧

4. METHOD FOR PRODUCING AT LEAST ONE PAD ASSEMBLY ON A SUPPORT FOR THE SELF-ASSEMBLY OF AN INTEGRATED CIRCUIT CHIP ON THE SUPPORT BY THE FORMATION OF A FLUORINATED MATERIAL SURROUNDING THE PAD AND EXPOSURE OF THE PAD AND THE FLUORINATED MATERIAL TO AN ULTRAVIOLET TREATMENT IN THE PRESENCE OF OZONE [P] . 欧洲知识产权局专利： EP2828888A1 . 2015-01-28

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5. METHOD FOR PRODUCING AT LEAST ONE PAD ASSEMBLY ON A SUPPORT FOR THE SELF-ASSEMBLY OF AN INTEGRATED CIRCUIT CHIP ON THE SUPPORT BY THE FORMATION OF A FLUORINATED MATERIAL SURROUNDING THE PAD AND EXPOSURE OF THE PAD AND THE FLUORINATED MATERIAL TO AN ULTRAVIOLET TREATMENT IN THE PRESENCE OF OZONE [P] . 世界知识产权组织专利： WO2013140094A1 . 2013-09-26

机译：通过围绕在垫板上的氟化材料的形成和垫的暴露以及氟化物对小孔的暴露，在支持的集成电路芯片上的自组装芯片的支撑上至少生产一个垫组件的方法臭氧

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