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Resin composition for adhesive, adhesive containing resin composition for adhesive, adhesive sheet containing resin composition for adhesive, and printed wiring board including adhesive or adhesive sheet as adhesive layer

机译:用于粘合剂的树脂组合物,用于粘合剂的包含粘合剂的树脂组合物,包含用于粘合剂的树脂组合物的粘合剂片以及包括粘合剂或粘合剂片作为粘合剂层的印刷电路板

摘要

Provided is a resin composition for an adhesive comprising a polyurethane resin containing a carboxyl group, having specific range of an acid value having specific range of a number average molecular weight and having specific range of a glass transition temperature a polyester resin having specific range of a number average molecular weight and having specific range of a glass transition temperature; an epoxy resin containing a nitrogen atom; and an epoxy resin having a dicyclopentadiene skeleton, in which a content rate of the polyurethane resin to a sum of the polyurethane resin and the polyester resin is 70 to 95 percent by mass, a content rate of the total epoxy resin contained in the resin composition to the sum of the polyurethane resin and the polyester resin is 5 to 30 percent by mass.
机译:提供一种用于粘合剂的树脂组合物,其包含具有特定范围的酸值,特定范围的数均分子量和特定范围的玻璃化转变温度的酸值的特定范围的具有羧基的聚氨酯树脂,具有特定范围的丙烯酸的聚氨酯树脂。数均分子量,具有玻璃化转变温度的特定范围。含氮原子的环氧树脂;以及具有二环戊二烯骨架的环氧树脂,其中,聚氨酯树脂相对于聚氨酯树脂与聚酯树脂的合计的含有率为70〜95质量%,树脂组合物中所含有的全部环氧树脂的含有率为聚氨酯树脂和聚酯树脂的合计量为5〜30质量%。

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