首页> 外国专利> Manufacturing method for contact for current inspection jig, contact for current inspection jig manufactured using said method, and current inspection jig provided with said contact

Manufacturing method for contact for current inspection jig, contact for current inspection jig manufactured using said method, and current inspection jig provided with said contact

机译:电流检查夹具用触头的制造方法,使用该方法制造的电流检查夹具用触头以及具备该触头的电流检查用夹具

摘要

Disclosed is a manufacturing method which enables manufacturing of an ultra-fine, thin contact for current inspection jigs. After a gold or gold alloy plating layer is formed, an Ni electroformed layer is formed by electroformation on the outer periphery of the formed plating layer. After a resistant layer is formed on the outer periphery of the Ni electroformed layer, a spiral groove is formed in the resistant layer by laser exposure, and etching is carried out using the resistant layer as a masking material. The Ni electroformed layer is removed from the part of the resistant layer where the spiral groove was formed, and then the resistant layer is removed and the plating layer is removed from the part of the spiral groove section where the Ni electroformed layer was removed. The core material is then removed, leaving the plating layer inside the periphery of the Ni electroformed layer.
机译:公开了一种制造方法,该方法能够制造用于电流检查夹具的超细,薄触点。在形成金或金合金镀层之后,在形成的镀层的外周上通过电铸形成Ni电铸层。在Ni电铸层的外周上形成电阻层之后,通过激光曝光在电阻层中形成螺旋槽,并且使用该电阻层作为掩模材料进行蚀刻。从电阻层的形成有螺旋槽的部分去除Ni电铸层,然后去除电阻层,并从螺旋槽部的去除了Ni电铸层的部分去除镀层。然后去除芯材料,将镀层留在Ni电铸层的外围内。

著录项

  • 公开/公告号US9109294B2

    专利类型

  • 公开/公告日2015-08-18

    原文格式PDF

  • 申请/专利权人 KESAO KOJIMA;YUTAKA ICHIKAWA;

    申请/专利号US201113578436

  • 发明设计人 KESAO KOJIMA;YUTAKA ICHIKAWA;

    申请日2011-01-27

  • 分类号H01R43;C25D1/02;C25D5/12;G01R3;C25D3/48;

  • 国家 US

  • 入库时间 2022-08-21 15:22:15

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