首页> 外国专利> Bi-modal power delivery scheme for an integrated circuit comprising multiple functional blocks on a single die to achieve desired average throughput for the integrated circuit

Bi-modal power delivery scheme for an integrated circuit comprising multiple functional blocks on a single die to achieve desired average throughput for the integrated circuit

机译:用于集成电路的双模功率传输方案,该集成电路在单个裸片上包括多个功能块,以实现所需的集成电路平均吞吐量

摘要

Systems and methods for bi-modal and fine grained power delivery to an integrated circuit comprising functional blocks. A first power source is coupled to a functional block of the integrated circuit for supporting a first operating mode of the functional block. A second power source is coupled to the functional block for supporting a second operating mode of the functional block. The first and second operating modes can be high and low frequency modes respectively. The second power source can be derived from the first power source using on-die regulators or provided independently. A desired average throughput of the functional block can be achieved by controlling duty cycles of the first and second power sources.
机译:用于将双峰和细粒度功率输送到包括功能块的集成电路的系统和方法。第一电源耦合到集成电路的功能块,以支持功能块的第一操作模式。第二电源耦合到功能块,以支持功能块的第二操作模式。第一和第二操作模式可以分别是高频和低频模式。第二电源可以使用管芯上的稳压器从第一电源获得,也可以独立提供。通过控制第一和第二电源的占空比,可以实现功能块的期望平均吞吐量。

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