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Interconnection designs and materials having improved strength and fatigue life
Interconnection designs and materials having improved strength and fatigue life
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机译:具有改善的强度和疲劳寿命的互连设计和材料
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摘要
Methods and designs for increasing interconnect areas for interconnect bumps are disclosed. An interconnect bump may be formed on a substrate such that the interconnect bump extends beyond a contact pad onto a substrate. An interconnect bump may be formed on a larger contact pad, the bump having a large diameter.
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