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60 GHZ INTEGRATED CIRCUIT TO PRINTED CIRCUIT BOARD TRANSITIONS

机译:60 GHZ集成电路到印刷电路板的转换

摘要

Embodiments are directed to a transition structure for interfacing an integrated circuit chip and a substrate, comprising: a co-planar waveguide (CPW) structure formed based on ground-signal-ground (GSG) pads on the integrated circuit chip, a grounded co-planar waveguide (CPWG) structure coupled to the GSG pads, and a microstrip coupled to the CPWG structure.
机译:实施例针对用于使集成电路芯片与衬底接口连接的过渡结构,其包括:基于集成电路芯片上的接地-接地-接地(GSG)焊盘形成的共面波导(CPW)结构,平面波导(CPWG)结构耦合到GSG焊盘,微带耦合到CPWG结构。

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