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Thickness shear mode resonator sensors and methods of forming a plurality of resonator sensors
Thickness shear mode resonator sensors and methods of forming a plurality of resonator sensors
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机译:厚度剪切模式谐振器传感器以及形成多个谐振器传感器的方法
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摘要
Arrays of resonator sensors include an active wafer array comprising a plurality of active wafers, a first end cap array coupled to a first side of the active wafer array, and a second end cap array coupled to a second side of the active wafer array. Thickness shear mode resonator sensors may include an active wafer coupled to a first end cap and a second end cap. Methods of forming a plurality of resonator sensors include forming a plurality of active wafer locations and separating the active wafer locations to form a plurality of discrete resonator sensors. Thickness shear mode resonator sensors may be produced by such methods.
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