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Thickness shear mode resonator sensors and methods of forming a plurality of resonator sensors

机译:厚度剪切模式谐振器传感器以及形成多个谐振器传感器的方法

摘要

Arrays of resonator sensors include an active wafer array comprising a plurality of active wafers, a first end cap array coupled to a first side of the active wafer array, and a second end cap array coupled to a second side of the active wafer array. Thickness shear mode resonator sensors may include an active wafer coupled to a first end cap and a second end cap. Methods of forming a plurality of resonator sensors include forming a plurality of active wafer locations and separating the active wafer locations to form a plurality of discrete resonator sensors. Thickness shear mode resonator sensors may be produced by such methods.
机译:谐振器传感器的阵列包括:有源晶片阵列,其包括多个有源晶片;第一端盖阵列,其耦接至有源晶片阵列的第一侧;以及第二端盖阵列,其耦接至有源晶片阵列的第二侧。厚度剪切模式谐振器传感器可以包括耦合到第一端盖和第二端盖的有源晶片。形成多个谐振器传感器的方法包括形成多个有源晶片位置并分离有源晶片位置以形成多个离散的谐振器传感器。厚度剪切模式谐振器传感器可以通过这样的方法来制造。

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