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Method to control the temperature of a high powered computing component through a liquid cooled heatsink responsive to an increase in the thermal value
Method to control the temperature of a high powered computing component through a liquid cooled heatsink responsive to an increase in the thermal value
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机译:响应于热值的增加而通过液体冷却的散热器来控制高功率计算组件的温度的方法
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摘要
Methods, systems, and products are provided for monitoring the temperature of a high powered computing component. The high powered computing component has a thermal sensor and the high powered computing component in thermal communication with a liquid cooled heatsink. Embodiments include determining, by a thermal monitoring module, a temperature of the thermal sensor; determining, by the thermal monitoring module, a temperature of the heatsink; determining, by the thermal monitoring module, a power delivered to the high powered computing component; and calculating, by the thermal monitoring module, a thermal value in dependence upon the temperature of the thermal sensor, the temperature of the heatsink, and the power delivered to the high powered computing component.
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