首页> 外国专利> Flexible pattern-oriented 3D profile for advanced process nodes

Flexible pattern-oriented 3D profile for advanced process nodes

机译:面向模式的灵活面向3D轮廓的高级过程节点

摘要

The present disclosure relates to a method of RC extraction that provides for a fast development time and easy maintenance. In some embodiments, the method provides a graphical representation of an integrated chip layout having a plurality of integrated chip components. A plurality of pattern based graphical features are then determined. Respective pattern based graphical features define a structural aspect of an integrated chip component. One of the plurality of integrated chip components is defined as a pattern oriented function having inputs of one or more of the pattern based graphical features. The pattern oriented function determines a shape of the one of the plurality of integrated chip components based upon a relation between the plurality of inputs. By determining a shape of an integrated chip component using a pattern oriented function, the complexity of RC profiles can be reduced.
机译:本发明涉及提供快速开发时间和容易维护的RC提取方法。在一些实施例中,该方法提供了具有多个集成芯片组件的集成芯片布局的图形表示。然后确定多个基于图案的图形特征。基于各个图案的图形特征定义了集成芯片组件的结构方面。多个集成芯片组件之一被定义为具有面向一个或多个基于模式的图形特征的输入的面向模式的功能。面向图案的功能基于多个输入之间的关系来确定多个集成芯片组件之一的形状。通过使用面向图形的功能确定集成芯片组件的形状,可以降低RC配置文件的复杂性。

著录项

相似文献

  • 专利
  • 外文文献
  • 中文文献
获取专利

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号