An object of the present invention is to provide a curable resin composition capable of giving a cured product which is excellent in mechanical properties (such as elastic modulus) and toughness. The curable resin composition contains 60 to 99 parts by mass of an unsaturated ester resin, 0.5 to 20 parts by mass of an epoxy resin, and 0.1 to 20 parts by mass of crosslinked rubber particles having a number average particle diameter of 20 nm to 600 nm. The crosslinked rubber particles are obtained by polymerizing a vinyl monomer in the presence of one or more rubber polymers selected from the group consisting of a butadiene rubber, a butadiene-styrene rubber, a butadiene-butyl acrylate rubber, a butyl acrylate rubber and an organosiloxane rubber.
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