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Methods for fabricating integrated passive devices on glass substrates
Methods for fabricating integrated passive devices on glass substrates
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机译:在玻璃基板上制造集成无源器件的方法
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摘要
A method includes forming a plurality of dielectric layers over a semiconductor substrate; and forming integrated passive devices in the plurality of dielectric layers. The semiconductor substrate is then removed from the plurality of dielectric layers. A dielectric substrate is bonded onto the plurality of dielectric layers.
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