SURFACE-PROTECTION TAPE FOR SEMICONDUCTOR WAFERS FOR USE DURING BACKGRINDING PROCESS AND SUBSTRATE FILM FOR THE SURFACE-PROTECTION TAPE

摘要

THE PRESENT INVENTION PROVIDES A SURFACE-PROTECTION TAPE FOR SEMICONDUCTOR WAFERS HAVING AN EVEN THICKNESS ACCURACY, EXCELLENT SURFACE SMOOTHNESS, AND EXCELLENT SURFACE SLIDING PROPERTIES SUCH AS FREEDOM FROM BLOCKING, ETC., AND A SUBSTRATE FILM FOR THE SURFACE-PROTECTION TAPE. THE SUBSTRATE FILM FOR THE SURFACE-PROTECTION TAPE FOR SEMICONDUCTOR WAFERS HAS AT LEAST ONE LAYER CONTAINING A POLYETHYLENE-BASED RESIN AND SATISFIES THE FOLLOWING REQUIREMENTS: (1) THE BACK AND FRONT SURFACES OF THE SUBSTRATE FILM HAVE A SURFACE ROUGHNESS RA MEASURED BASED ON JIS B0601 OF NOT MORE THAN 0.8 µM, AND AT LEAST ONE SURFACE THEREOF HAS A SURFACE ROUGHNESS RA OF NOT LESS THAN 0.05 µM; AND (2) THE DIFFERENCE BETWEEN THE MAXIMUM AND MINIMUM THICKNESSES OF THE SUBSTRATE FILM IS NOT MORE THAN 4 µM. THE PRESENT INVENTION ALSO PROVIDES A SURFACE PROTECTION TAPE FOR SEMICONDUCTOR WAFERS COMPRISING THE SUBSTRATE FILM AND AN ADHESIVE LAYER. FIGURE 1