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Treatment device ion bombardment, and method for cleaning the surface of the base material using the treatment device
Treatment device ion bombardment, and method for cleaning the surface of the base material using the treatment device
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机译:处理装置离子轰击,以及使用该处理装置清洁基材表面的方法
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摘要
An apparatus (1) treatment of ion bombardment to clean a surface of a material (W) based placed in a chamber (2) vacuum irradiating gas ions generated in the chamber (2) vacuum, comprising: an electrode (3) thermal emission type electron heating placed on an inner surface of the chamber (2) formed by vacuum and a filament; an anode (4) placed on another inner surface of the chamber (2) vacuum, receiving the anode (4) a thermal electron from the electrode (3) emitting thermal electrons; a tool (11) 10 retaining base material to retain the material (W) basis in a manner such that the material (W) base is positioned between said electrode (3) emitting thermal electrons and said anode (4); a source (5) feed discharge to generate a glow discharge upon application of a potential difference between said electrode (3) emitting thermal electrons and said anode (4); a source (6) supply for heating said electrode (3) emitting thermal electrons in order to emit thermal electrons; and a source (12) bias supply for applying negative potential with respect to the chamber (12) of vacuum to the material (W) base, wherein said source (6) heating power is not connected to the chamber (2) vacuum, and gas ions generated by said source (5) feeding discharge, said source (6) of heating power, and said source (12) of bias power is irradiated to the surface of the material (W) base, characterized by a transformer (13) of insulation for connecting said source (6) heating power to said electrode (3) emitting thermal electrons in a state of electrical insulation, where an output of the negative side of said source ( 5) power is connected to said discharge electrode (3) emitting thermal electrons through a coil (15) of said transformer secondary (13) of insulation, and said source (5) feed and discharge not t is connected to said source (6) heating power, while not connected to the chamber (2) vacuum.
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