首页> 外国专利> METAL MICRONEEDLE ARRAY, TRANSDERMAL DELIVERY PATCH, AND MICRONEEDLE TRANSDERMAL DELIVERY STAMP

METAL MICRONEEDLE ARRAY, TRANSDERMAL DELIVERY PATCH, AND MICRONEEDLE TRANSDERMAL DELIVERY STAMP

机译:金属微针阵列,皮下传递贴片和微针皮下传递印章

摘要

A metal microneedle array, a transdermal delivery patch with the metal microneedle array, and a microneedle transdermal delivery stamp. The metal microneedle array comprises a substrate (1) and at least one metal sheet (2). The substrate (1) is a solid plate, a solid cylindrical body or a hollow cylindrical body, and has an operation surface in a plane or curved surface shape. The metal sheet (2) is fixed on the substrate (1). Multiple integral microneedles (3) spaced to each other are formed on at least one edge of the metal sheet (2). Each microneedle (3) has a free end and a fixed end connected to the metal sheet (2). A structure of the free end of the microneedle (3) is a needle point (4). The metal sheet (2) is embedded in the operation surface, and at least one part of the microneedle (3) protrudes over the operation surface to form a preset angle with the operation surface. The microneedles (3) in the microneedle array have good consistency, and the manufacturing process of the microneedle array is simplified, and flexibility of the structure design and application is good.
机译:金属微针阵列,具有金属微针阵列的透皮递送贴片和微针透皮递送印章。金属微针阵列包括基底(1)和至少一个金属片(2)。基板(1)是实心板,实心圆柱体或中空圆柱体,并且具有平面或曲面形状的操作表面。金属片(2)被固定在基板(1)上。在金属板(2)的至少一个边缘上形成有彼此隔开的多个一体的微针(3)。每个微针(3)具有一个自由端和一个固定端,该固定端连接到金属片(2)上。微针(3)的自由端的结构是针尖(4)。金属片(2)被嵌入在操作表面中,并且微针(3)的至少一部分在操作表面上方突出以与操作表面形成预设角度。微针阵列中的微针(3)一致性好,简化了微针阵列的制造工艺,结构设计和应用的灵活性好。

著录项

  • 公开/公告号WO2014187338A1

    专利类型

  • 公开/公告日2014-11-27

    原文格式PDF

  • 申请/专利权人 TSINGHUA UNIVERSITY;

    申请/专利号WO2014CN78116

  • 发明设计人 YUE RUIFENG;WANG YAN;

    申请日2014-05-22

  • 分类号A61M37;

  • 国家 WO

  • 入库时间 2022-08-21 15:10:01

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