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DUAL MAGNETRON SPUTTERING POWER SUPPLY AND MAGNETRON SPUTTERING APPARATUS

机译:双磁控溅射电源和磁控溅射装置

摘要

A dual magnetron sputtering power supply for use with a magnetron sputtering apparatus having at least first and second sputtering cathodes for operation in the dual magnetron sputtering mode, there being a means for supplying a flow of reactive gas to each of said first (1) and second (4) cathodes via first (12) and second (14) flow control valves each associated with a respective one of said first and second cathodes and each adapted to control a flow of reactive gas to the respectively associated cathode, the power supply having, for each of said first and second cathodes a means for deriving a feed-back signal relating to the voltage prevailing at that cathode, a control circuit for controlling the flow of reactive gas to the respectively associated cathode by controlling the respective flow control valve and adapted to adjust the respective flow control valve to obtain a voltage feedback signal from the respective cathode corresponding to a set point value set for that cathode. Also claimed is a magnetron sputtering apparatus in combination with such a power supply.
机译:与磁控溅射设备一起使用的双磁控溅射电源,具有至少第一和第二溅射阴极,用于在双磁控溅射模式下操作,存在一种装置,用于向所述第一(1)和(1)中的每一个提供反应性气体流。经由第一(12)和第二(14)流量控制阀的第二(4)阴极,每个第一和第二流量控制阀与所述第一和第二阴极中的相应一个相关联,并且每个适于控制反应性气体流向分别相关联的阴极,电源具有对于所述第一和第二阴极中的每一个,用于导出与在该阴极上占主导的电压有关的反馈信号的装置,控制电路,该控制电路用于通过控制相应的流量控制阀和控制到相应的阴极的反应性气体的流量。适于调节相应的流量控制阀,以从相应的阴极获得与为该阴极设定的设定点值相对应的电压反馈信号。还要求保护的是一种与这种电源结合的磁控溅射设备。

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