Provided is a resin composition that enables a thermally-conductive cured product having excellent thermal conductivity to be produced. This resin composition contains a carrier that supports a silane coupling agent composition, said silane coupling agent composition containing a silicon compound represented by general formula (1). (In general formula (1), each R1 represents, independently, a straight or branched C1-C3 alkyl group, A1 represents a single bond or a C1-C4 alkanediyl group, and Y represents a hydrogen atom, a C1-C12 straight or branched alkyl group, or the like.)
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