首页> 外国专利> RESIN COMPOSITION, THERMALLY-CONDUCTIVE CURED PRODUCT, SILICON COMPOUND, SILANE COUPLING AGENT COMPOSITION AND CARRIER

RESIN COMPOSITION, THERMALLY-CONDUCTIVE CURED PRODUCT, SILICON COMPOUND, SILANE COUPLING AGENT COMPOSITION AND CARRIER

机译:树脂成分,导热导热产品,硅化合物,硅烷偶联剂成分和载体

摘要

provides a resin composition that can be manufactured by heat-conductive cured product having an excellent thermal conductivity. Carrying the silane coupling agent composition containing a carrier and a silane coupling agent composition is, to a resin composition containing a silicon compound represented by the general formula (1). Of the (general formula (1), R 1 is an alkyl group of a straight-chain or branched-display of 1 to 3 carbon atoms in the respective independent and, A 1 is a single display a bond or a 1 to 4 carbon atoms in the alkanediyl weather and also Y represents the hydrogen atom, the carbon atom number of the alkyl group such as a straight-chain or branched-1~12)
机译:提供了一种树脂组合物,其可以通过具有优异导热率的导热固化产物来制造。将包含载体和硅烷偶联剂组合物的硅烷偶联剂组合物承载在包含通式(1)表示的硅化合物的树脂组合物中。在(通式(1)中,R 1 是分别独立且A 1 是单键,在烷二基天气中显示一个键或1-4个碳原子,并且Y表示氢原子,烷基的碳原子数如直链或支链-1〜12)

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