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HOLE TRANSPORTING LAYER COMPOSITION COMPRISING POLYMER HOLE TRANSPORTING MATERIAL INCLUDING CROSSLINKABLE DOUBLE BOND AND CROSSLINKING AGENT INCLUDING TWO OR MORE THIOL GROUPS AND USE THEREOF
HOLE TRANSPORTING LAYER COMPOSITION COMPRISING POLYMER HOLE TRANSPORTING MATERIAL INCLUDING CROSSLINKABLE DOUBLE BOND AND CROSSLINKING AGENT INCLUDING TWO OR MORE THIOL GROUPS AND USE THEREOF
The present invention provides a hole transporting layer (HTL) composition comprising: a polymer hole transporting material including a first monomer having a first hole transporting fragment and a second monomer having a second hole transporting fragment and one or more crosslinkable double bonds; and a crosslinking agent including two or more thiol groups. In addition, the present invention provides a method for fabricating an organic semiconductor device including one or more stacked organic layers, the method comprising: a first step of applying a first organic layer composition comprising a first organic semiconductor material having two or more crosslinkable double bonds and a crosslinking agent having two or more thiol groups; a second step of crosslinking the first organic layer composition by applying light or heat thereto; and a third step of applying a solution type second organic layer composition onto the formed first organic layer.
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