EXPOSED DIE PACKAGE FOR DIRECT SURFACE MOUNTING

摘要

A packaged semiconductor device (100) includes a semiconductor die (110) including a substrate (112) having a top side (113) including active circuitry (114) and a bottom side (116) with at least one back side metal layer (118) directly attached. A package (130) including a molding material (132) having a die pad (125) and a plurality of leads (127) is encapsulated within the molding material, wherein the leads include an exposed portion 127(a) that includes a bonding portion 127(a)(1). The top side of the semiconductor die is attached to the die pad, and the package includes a gap that exposes the back side metal layer along a bottom surface of the package. Bond wires couple pads on the top side of the semiconductor die to the leads. The bonding portions, the molding material along the bottom surface of the package, and the back side metal layer are all substantially planar to one another.