首页> 外国专利> PROMOTING TRANSCRANIAL DIRECT CURRENT STIMULATION OR TRANSCRANIAL MAGNETIC STIMULATION USING TEMPERATURE-INDUCED SYNAPTIC MODULATION

PROMOTING TRANSCRANIAL DIRECT CURRENT STIMULATION OR TRANSCRANIAL MAGNETIC STIMULATION USING TEMPERATURE-INDUCED SYNAPTIC MODULATION

机译:利用温度诱导的突触调制促进经颅直接电流刺激或经颅磁刺激

摘要

Disclosed herein are representative embodiments of methods, systems, and apparatus for enhancing or diminishing synaptic strength. Embodiments of the disclosed methods, systems, and apparatus can be used, for example, to complement the change in synaptic strength from transcranial direct current stimulation ("tDCS") or transcranial magnetic stimulation ("TMS") systems. One exemplary embodiment disclosed herein is a flexible housing having a top surface and a bottom surface. The flexible housing of this embodiment comprises a recessed cavity on the bottom surface that is configured to at least partially enclose an electrode of a transcranial direct current stimulator system. The flexible housing of this embodiment further comprises one or more apertures configured to provide access to the recessed cavity when the electrode is positioned within the recessed cavity. The flexible housing can further comprise one or more heating or cooling elements that can be selectively activated before, during, and/or after tDCS or TMS stimulation.
机译:本文公开了用于增强或减小突触强度的方法,系统和装置的代表性实施方案。例如,可以使用所公开的方法,系统和装置的实施例来补充来自经颅直流电刺激(“ tDCS”)或经颅磁刺激(“ TMS”)系统的突触强度的变化。本文公开的一个示例性实施例是具有顶表面和底表面的柔性壳体。该实施例的柔性壳体包括在底表面上的凹腔,该凹腔构造成至少部分地包围经颅直流刺激器系统的电极。该实施例的柔性外壳还包括一个或多个孔,该孔被配置为当电极位于凹腔内时提供通向凹腔的通道。柔性壳体可以进一步包括一个或多个加热或冷却元件,其可以在tDCS或TMS刺激之前,期间和/或之后被选择性地激活。

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