MULTILAYER WIRING TYPE DOUBLE-INTERFACE IC CARD ANTENNA MODULE

摘要

Disclosed is a multilayer wiring type double-interface IC card antenna module, comprising: an electrode diaphragm layer (1), a clamping base layer (2), an RFID antenna layer (3), an insulation layer (4) and a bridge layer (5). The electrode diaphragm layer (1) comprises an antenna and an electrode diaphragm. The clamping base layer (2) is arranged below the electrode diaphragm layer (1), and comprises eight first through hole points (21) located right below eight metal contacts on the electrode diaphragm. The RFID antenna layer (3) is arranged below the clamping base layer (2), and comprises an RFID antenna, a connecting contact, a first chip attaching point and a second chip attaching point, the connecting contact and the first chip attaching point being connected to two ends of the RFID antenna. The insulation layer (4) is arranged below the RFID antenna layer (3), and comprises eight second through hole points located right below the eight first through hole points, a third through hole point located right below the connecting contact, a fourth through hole point located right below the first chip attaching point, and a fifth through hole point located right below the second chip attaching point. The bridge layer (5) is arranged below the insulation layer (4) and connected with the second chip attaching point and the connecting contact in a bridging manner. The antenna module can achieve full-automatic production.