POLYMER RESIN COMPOSITION, POLY-IMIDE RESIN FILM, PREPARATION METHOD OF THE POLY-IMIDE RESIN FILM, METALLIC LAMINATE, AND CIRCUIT BOARD

摘要

The present invention is a metal lamination including the excellent mechanical properties and a polymer resin composition which can provide an insulating material having a low dielectric constant, a polyimide resin film and the manufacturing method of the polyimide resin film obtained by using this, and the polyimide resin film It relates to the body and the circuit board. ;