Disclosed is a hydrodynamic heat dissipating device. According to an embodiment of the present invention, the hydrodynamic heat dissipating device includes: an LED chip; a thermal base which is combined with the LED chip to adsorb heat generated from the LED chip; a first heat pipe loop in a vibration capillary type which composes a heat absorbing unit to be formed in a capillary type, inject operation fluid, and be combined with the thermal base to transfer the heat, and a heat radiating unit which radiates the heat absorbed from the absorbing unit; and a heat balancing unit which is combined with the first heat pipe loop to prevent temperature tolerance by circulating the heat of the first heat pipe loop.
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