PLATING APPARATUS AND PLANTING SYSTEM HAVING SAME

摘要

The present invention relates to a plating apparatus. The plating apparatus comprises: an electrolyzer to which a plating solution is received; a pH sensing sensor for sensing a pH concentration of the plating solution received to the electrolyzer; a pH correction material inputting machine for inputting a pH correction material to the electrolyzer according to pH measured by the pH sensing sensor; a ratio measuring machine comprising a controller for controlling the pH correction medicine inputting machine and the pH sensing sensor, for measuring the ratio of the plating solution received to the electrolyzer; a current value measuring machine comprising a ratio correction material inputting machine for inputting a ration correction material according to a ratio value measured by the ratio measuring machine, for measuring an integrating current value of a rectifier for rectifying a current supplied to the electrolyzer; and a concentration correction material inputting machine for inputting a concentration correction material according to the current value measured by the current value measuring machine. According to the construction, the pH ratio and current value are automatically measured at set intervals, and if the measured value is beyond set parameters, the quality of a plated product is uniformed by inputting the correcting material in real time, and the inputted correction material can be reduced.;COPYRIGHT KIPO 2015