POLYIMIDE PRECURSOR, PHOTOSENSITIVE RESIN COMPOSITION CONTAINING SAID POLYIMIDE PRECURSOR, AND CURED-PATTERN-FILM MANUFACTURING METHOD AND SEMICONDUCTOR DEVICE USING SAID PHOTOSENSITIVE RESIN COMPOSITION

摘要

A polyimide precursor including a structural unit represented by the following general formula (1) in a ratio of 50 mol % or more based on the total structural units. In the general formula (1), A is a tetravalent organic group represented by the following general formula (2a), a tetravalent organic group represented by the following general formula (2b), or a tetravalent organic group represented by the following general formula (2c), and B is a divalent organic group represented by the following general formula (3).