A method of manufacturing a Cu-Ga alloy powder capable of easily producing a high-quality Cu-Ga alloy powder, a method of producing a Cu-Ga alloy powder, a method of manufacturing a Cu-Ga alloy sputtering target, and a Cu-Ga alloy sputtering target. In the present invention, a Cu-Ga alloy powder is obtained by agitating a mixed powder in which Cu powder and Ga are mixed in a mass ratio of 85: 15 to 55: 45 in an inert atmosphere at a temperature of 30 to 700 deg. Further, this Cu-Ga alloy powder is molded and sintered to obtain a Cu-Ga alloy sputtering target.
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