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Effect of powder alloy composition on the microstructure and properties of kinetic sprayed Cu-Ga based coating materials

机译:粉末合金成分对动力喷涂Cu-Ga基涂层材料组织和性能的影响

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摘要

This study attempted to manufacture Cu-Ga coating materials via the kinetic spray process and examined the effect of powder alloy composition on the microstructure and properties of the kinetic sprayed Cu-Ga based coating materials. Cu-15 at%Ga, Cu-20 at%Ga, and Cu-30 at%Ga powders were prepared and used. Annealing heat treatments were conducted at 200 A degrees C similar to 800 A degrees C. The results showed that the coating layers could be manufactured with Cu-15 at%Ga and Cu-20 at%Ga powders via the kinetic spray process, except for Cu- 30 at%Ga. A single phase of pure Cu was observed in the Cu-15 at%Ga coating layer and Cu and Cu3Ga phases in the Cu-20 at%Ga coating layer. A small amount of Ga2O3 was also detected between deposited particles in both coating layers. It was difficult to obtain the coating layer due to the shattering of powders during the kinetic spraying with Cu-30 at%Ga powder, which is made up of a variety of inter-metallic compounds. Porosity and hardness decreased as the annealing temperature increased, and porosity decreased into 0.48% (Cu-15 at%Ga), 0.74%(Cu-20 at%Ga) at 800 A degrees C. Annealing heat treatment appeared to be effective in enhancing the density of the coating layers without generating a new phase. This study also considered to suggest the optimal alloy composition of kinetic sprayed Cu-Ga based coating material for sputtering target.
机译:这项研究试图通过动力喷涂工艺制造Cu-Ga涂层材料,并研究了粉末合金成分对动力喷涂Cu-Ga基涂层材料的微观结构和性能的影响。制备并使用了Cu-15 at%Ga,Cu-20 at%Ga和Cu-30 at%Ga粉末。在类似于800 A的200 A的温度下进行退火热处理。结果表明,可以通过动力学喷涂工艺用Cu-15 at%Ga和Cu-20 at%Ga粉末制造涂层。 Cu 30 at%Ga。在Cu-15 at%Ga涂层中观察到纯铜的单相,而在Cu-20 at%Ga涂层中观察到Cu和Cu3Ga相。在两个涂层中的沉积颗粒之间也检测到少量的Ga2O3。由于在动态喷涂含多种金属间化合物的Cu-30 at%Ga粉末时,粉末会破碎,因此很难获得涂层。孔隙率和硬度随退火温度的升高而降低,并且在800 A的温度下孔隙率分别下降至0.48%(Cu-15 at%Ga),0.74%(Cu-20 at%Ga)。退火热处理似乎对提高合金强度有效涂层的密度而不产生新的相。这项研究还认为建议用于溅射靶的动态喷涂Cu-Ga基涂层材料的最佳合金成分。

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