SEMICONDUCTOR DEVICE MEMBER, LIQUID FOR FORMING SEMICONDUCTOR DEVICE MEMBER, METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE MEMBER, AND LIQUID FOR FORMING SEMICONDUCTOR DEVICE MEMBER USING THE METHOD, PHOSPHOR COMPOSITION, SEMICONDUCTOR LIGHT EMITTING DEVICE, ILLUMINATING APPARATUS AND IMAGE DISPLAY APPARATUS

摘要

Disclosed is a member for a semiconductor device which is excellent in heat resistance, light resistance, film forming property, and adhesion, and can hold a phosphor by encapsulating a semiconductor device without causing cracking, peeling, or coloring even when used for a long period of time. Therefore, the heating weight measured according to the predetermined heating weight measurement method is set to 50% by weight or less for the semiconductor device member, and the peeling ratio measured according to the predetermined adhesion evaluation method is set to 30% or less.