首页> 外国专利> GLASS FRIT USING GLASS POWDER WITH LOW MELTING POINT AND CRYSTALLINE CERAMIC FILLER WITH LOW EXPANSION AND PASTE COMPRISING THE SAME

GLASS FRIT USING GLASS POWDER WITH LOW MELTING POINT AND CRYSTALLINE CERAMIC FILLER WITH LOW EXPANSION AND PASTE COMPRISING THE SAME

机译:低熔点玻璃粉和低膨胀度结晶陶瓷填充料的玻璃料

摘要

Disclosed are a glass frit using low melting point glass powder with superior durability, sealing reliability, and water resistance which is suitable for an OLED panel sealing, and a low expansion crystalline ceramic filler which controls a coefficient of thermal expansion, and a paste including the same. According to the present invention, the low melting point glass frit comprises the low melting point glass powder consisting of 0.1-20mol% of V2O5, 30-60mol% of ZnO, 10-30mol% of B2O3, 0.1-10mol% of BaO, 0.1-10mol% of SiO2, 0.1-15mol% of TeO2, and 2-20mol% of at least one of CuO, Fe2O3, and Co3O4; and less than 70 parts by weight of low expansion crystalline ceramic filler with respect to 100 parts by weight of the low melting point glass powder.
机译:公开了一种玻璃粉,其使用具有优异的耐久性,密封可靠性和耐水性的低熔点玻璃粉,其适合于OLED面板的密封,以及控制热膨胀系数的低膨胀结晶性陶瓷填料,以及包括该玻璃粉的糊料。相同。根据本发明,低熔点玻璃料包括低熔点玻璃粉末,该粉末由0.1-20mol%的V 2 O 5,30-60mol%的ZnO,10-30mol%的B 2 O 3,0.1-10mol%的BaO,0.1组成。 -10mol%的SiO 2,0.1-15mol%的TeO 2和2-20mol%的CuO,Fe 2 O 3和Co 3 O 4中的至少一种;相对于100重量份的低熔点玻璃粉末,小于70重量份的低膨胀性结晶陶瓷填料。

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