AQUEOUS GRINDING COMPOSITION AND METHOD FOR CHEMICAL-MECHANICAL GRINDING OF THE SUBSTRATES, WHICH HAVE THE STRUCTURED OR UNSTRUCTURED DIELECTRIC LAYERS VERSATILE BY LOW DIELECTRIC CONSTANT

摘要

1. An aqueous polishing composition comprising (A) at least one type of abrasive particles and (B) at least one amphiphilic nonionic surfactant is selected from the group consisting of water-soluble or water-dispersible surfactants, having (b1) at least one hydrophobic group selected from the group consisting of branched alkyl groups having 5-20 carbon atoms; and (b2) at least one hydrophilic group selected from the group consisting of polyoxyalkylene groups comprising (b21) oxyethylene monomer units and (b22) at least one type of substituted oxyalkylene monomer units, wherein the substituents are selected from the group consisting of alkyl, cycloalkyl, or aryl, alkyl-cycloalkyl, alkyl-aryl, cycloalkyl-alkyl, aryl and cycloalkyl-aryl groups; wherein said polyoxyalkylene group containing monomer units (b21) and (b22) in a statistical, an alternating, a gradient / Or blokopodobnom raspredelenii.2. The aqueous polishing composition of claim 1, wherein the hydrophobic groups (b1) selected from the group consisting of branched alkyl groups having 8-15 ugleroda.3 atoms. The aqueous polishing composition of claim 1, wherein the oxyalkylene monomer units (b22) are derivatives of substituted oxiranes, where the substituents are selected from the group consisting of alkyl, cycloalkyl, or aryl, alkyl-cycloalkyl, alkyl-aryl, cycloalkyl-aryl and cycloalkyl-alkyl-aryl grupp.4. The aqueous polishing composition of claim 3, wherein the substituents are selected from the group consisting of alkyl groups having 1-10 atoms ugler