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A method for producing a module strip

机译:一种生产模块条的方法

摘要

In a method for preparing a module strip (200) with projections (240) in a on one side of the module strip (200) are electrically conductive layer (230), first of all a carrier layer (220) and the electrically conductive layer (230) is provided. Furthermore, a female dies film (300) is provided, which has recesses (310). The matrices film (300), together with the carrier layer (220) and the electrically conductive layer (230) of a laminated continuously fed to the two press (100). In this case, the electrically conductive layer (230) between the matrices film (300) and the carrier layer (220) is arranged. The carrier layer (220), with the electrically conductive layer (230) in the endless press (100) of the two laminated in a continuous process to the module strips (200) connected. In this case, the electrically conductive layer (230) in the recesses (310) of the dies film (300) is pressed, as a result of which the desired raised portions (240) in the electrically conductive layer (230) are.
机译:在一种用于制备模块带(200)的方法中,在模块带(200)的一侧上具有突起(240)是导电层(230),首先是载体层(220)和导电层(230)被提供。此外,提供具有凹部(310)的阴模膜(300)。基质膜(300)以及载体层(220)和层压的导电层(230)一起被连续地供给到两个压机(100)。在这种情况下,在基质膜(300)和载体层(220)之间布置了导电层(230)。载体层(220),其中的导电层(230)在连续的压力机(100)中,以连续的过程层压到连接的模块条(200)上。在这种情况下,压模膜(300)的凹部(310)中的导电层(230),其结果是,导电层(230)中的期望的凸起部分(240)被压紧。

著录项

  • 公开/公告号DE102013020555A1

    专利类型

  • 公开/公告日2015-06-11

    原文格式PDF

  • 申请/专利权人 GIESECKE & DEVRIENT GMBH;

    申请/专利号DE20131020555

  • 发明设计人 MICHAEL BALDISCHWEILER;

    申请日2013-12-09

  • 分类号H05K3/40;H05K1/11;B32B37/20;B32B38/06;

  • 国家 DE

  • 入库时间 2022-08-21 14:55:41

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