A method of mounting an electrical component using a hood and a hood suitable for use in this method

摘要

The invention relates to a method for mounting an electrical component (12) on a substrate (13). According to the invention the joining by a hood (11) is simplified by a contacting structure (16) is provided in this hood and this at the touchdown of the hood (11) on different levels Fügel (28, 29) is added simultaneously with a filler material (35). In addition, a required joining pressure can be built up via the hood, as required, for example, in the case of diffusion connections or sintered connections of the electrical contacts. Furthermore, the invention relates to a hood which is suitable for use in said method.