A method of mounting an electrical component using a hood and a hood suitable for use in this method

摘要

The invention relates to a method for mounting an electrical component (12) on a substrate (13). According to the invention the joining by a hood (11) is simplified by a contacting structure (16) is provided in this hood and this when putting the hood (11) on different levels Fügel (28, 29) is added simultaneously with a filler material (35). Furthermore, the invention relates to a hood which is suitable for use in said method. According to the invention, the hood consists of a thermally softenable or thermally curable material, preferably of a resin or a thermoplastic material. The hood is preferably heated when joining the compounds so far that they can be plastically deformed. Advantageously tolerances are compensated during the joining, so that it can lead to a reliable training of all compounds. In addition, a required joining pressure can be built up via the hood, as required, for example, in the case of diffusion connections or sintered connections of the electrical contacts.