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SEMICONDUCTOR LIGHT-EMITTING DEVICE WITH A HIGHLY REFLECTIVE OHMIC-ELECTRODE AND METHOD FOR FABRICATION THEREOF

机译:具有高反射性卤素电极的半导体发光器件及其制造方法

摘要

A semiconductor light-emitting device includes a multilayer semiconductor structure on a conductive substrate. The multilayer semiconductor structure includes a first doped semiconductor layer situated above the conductive substrate, a second doped semiconductor layer situated above the first doped semiconductor layer, and/or an MQW active layer situated between the first and second doped semiconductor layers. The device also includes a reflective ohmic-contact metal layer between the first doped semiconductor layer and the conductive substrate, which includes Ag, and at least one of: Ni, Ru, Rh, Pd, Au, Os, Ir, and Pt; plus at least one of: Zn, Mg Be, and Cd; and a number of: W, Cu, Fe, Ti, Ta, and Cr. The device further includes a bonding layer between the reflective ohmic-contact metal layer and the conductive substrate, a first electrode coupled to the conductive substrate, and a second electrode coupled to the second doped semiconductor layer.
机译:半导体发光器件在导电基板上包括多层半导体结构。多层半导体结构包括位于导电衬底上方的第一掺杂半导体层,位于第一掺杂半导体层上方的第二掺杂半导体层和/或位于第一掺杂半导体层和第二掺杂半导体层之间的MQW有源层。该装置还包括在第一掺杂半导体层和导电衬底之间的反射性欧姆接触金属层,该反射性欧姆接触金属层包括Ag,以及Ni,Ru,Rh,Pd,Au,Os,Ir和Pt中的至少一个;和。加上以下至少一种:Zn,Mg Be和Cd;以及许多:W,Cu,Fe,Ti,Ta和Cr。该器件还包括在反射欧姆接触金属层和导电衬底之间的结合层,耦合到导电衬底的第一电极和耦合到第二掺杂半导体层的第二电极。

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